PCB has become a base element for any type of fabrication processes adopted in all the dominant industries across the globe. With changing trends and fades the challenges for PCB manufacturers has been increasing to provide highly customized end to end electronic solutions to its customer base.
With the onset of 1900’s, the novelty of printed circuit boards got started with a profound concept of constructing an electrical path on an isolated surface of a board. The initial trend of printed circuit board got into a vain to develop and upgrade the radios and gramophones. Gradually the notion of ‘Through Hole Technique’ came into picture to produce a double sided PCB.
In mid 1990’s the idea of auto assembly process was introduced by PCB manufacturer, USA. This was a point of modern touch to enhance the fabrication process with automated soldering technique. The research and development picked up a pace for end to end electronic solutions for the defense and US army.
Most of the major inventions with respect to printed circuit boards were a core concentration of US PCB market. The strides to up gradation in the fabrication process of PCB’s marked great developments in the electronic world. From high speed digital and analog designs to high layer count boards to high pin count BGA with different fabrication methods like elector mechanical assembly, cable harness assembly, box build assembly and backplane assembling process noted demand of customized PCB’s in all dominant industries.
With the cutting edge competition, there has been a great challenge for the PCB manufacturers to go for newer inventions in the market and differentiate themselves from the whole chunk. This can be a highlight to one of the inventions of CiP (Circuits in Plastic) which is a new technique for providing electronic manufacturing solutions wherein the eco friendly approach is adopted to go for PCB fabrication process with slim and sleekness in the PCB.
Nowadays common advanced methods adopted by the printed circuit board manufacturer are the state-of-the-art-techniques by using ‘surface mount technology’, ‘integrated circuits’ and ‘hybrid circuits’ assemblies. With dynamic methods of PCB manufacturing there has been a wide range of different types of PCB’s designed as per the requirements of the customers. The flexibility in the techniques of fabrication is with respect to the PCB profiling, micro drilled holes, material thickness, surface finishing and solder mask capabilities.
Things are now becoming in great demand from jumbo versions to miniaturization with the origination of nano technology. Since a decade ,there has been a high application of the ‘state of art technique’ to create different types of PCB’s with nano scale spheres consisting of high performance materials, radio frequency applications, HDI ( High Density Interconnect ) technology, LCD ( Liquid crystal display) and LED ( Light- emitting diode) technology .
With this the hypothesis for a new approach to customization was noted to provide a rare of a kind of PCB manufacturing service to the customers. There was a mark of revisions in the functional designs and layouts with high end customizations in the printed circuits mechanized in the multilayered boards. The concept of customization was embraced for the PCB requirements for the aircrafts, defense, telecommunication, pharmaceutics, robotics and other industries that required flexible electronic solutions.
The PCB assembly methods used by the fabricators majorly are the box build assembly, cable harness assembly and rigid/flex PCB assembly. Many of the industries are now demanding for the complete turnkey solution right from material procurement, designing, prototyping to shipping the order. This has made the PCB manufacturers to provide flexi solutions to its customers with respect to the complete turnkey solution and consigned PCB Assembly.
The current trend is of tendering to the exact needs of customers with cost effective approach in the fabrication process. Thus the applicability and usage of printed circuit boards for providing electronic design and manufacturing solutions has become a prime base for minor advancements and up-gradations to the major innovations.
